How HFCL and MediaTek Are Enabling Self-Install 5G Broadband

At MWC 2024, HFCL showcased its next-generation 5G Fixed Wireless Access (FWA) Indoor CPE, powered by MediaTek’s T750 chipset. This collaboration brings together HFCL’s telecom innovation and MediaTek’s semiconductor expertise to solve last-mile connectivity challenges with a compact, energy-efficient solution.

The HFCL 5G FWA Indoor CPE features a highly integrated 7nm chipset, dual-band Wi-Fi 6, 2.5 Gbps Ethernet, embedded eSIM, and AI-powered self-installation app. Its plug-and-play design, zero-touch provisioning, and support for SA/NSA networks make it ideal for telcos aiming to deliver fiber-like wireless broadband without the complexity of physical fiber rollouts.

Mr. Mahendra Nahata, Managing Director, HFCL said:
“We are pleased to have partnered with MediaTek, a leading global fabless semiconductor company, and to leverage its state-of-the-art 7nm compact chipset in crafting the revolutionary HFCL 5G FWA Indoor CPE... This marks another major milestone for HFCL in delivering advanced 5G solutions to telecom operators globally.”

Evan Su, General Manager, Wireless Communications, MediaTek said:
“HFCL’s ‘made-in-India’ 5G FWA Indoor CPE powered by the MediaTek T750 chip will help customers experience 5G FWA connectivity globally... Our modem propels their vision by offering full functionality... in the most efficient form factors.”

This partnership is a significant step toward accelerating 5G connectivity—made in India, for the world.

‍